Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies

DUBLIN, Ireland, April 14, 2014 /PRNewswire/ —

Research and Markets ( has announced the addition of the “Niche Markets and Strategies for Small/Mid-size Semiconductor Equipment Companies” report to their offering.

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In this report we identify areas of semiconductor-related technologies where a small or mid-sized company can compete.

These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers.

The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

Key Topics Covered:

Chapter Introduction

Chapter 2 Niche Markets for PROCESSES for 300mm Wafers

2.1 Introduction
2.2 Wafer Level Processing (WLP)
2.2.1 Introduction
2.2.2 Flip Chip/WLP Processing Issues and Trends
– Wafer Bumping
– Wafer Level Packaging
– Pad Redistribution
– Wafer Bumping Costs

2.2.3 Lithography Issues And Trends
2.2.4 UBM Etch Issues And Trends
2.2.5 Metallization Issues and Trends
– Gold Bumping Metallization
– Solder Bumping Metallization

2.2.6 Analysis of WLP Market
2.3 3-D TSV
2.3.1 Insight Into Critical Issues
2.3.2 Cost Structure
2.3.3 Critical Processing Technologies
2.3.4 Evaluation Of Critical Development Segments
2.3.5 TSV Device Forecast
2.4 Non-volatile Memory Devices MRAM, RRAM and FeRAM
2.4.1 Processing Requirements for MRAMs
2.4.2 Processing Requirements for RRAMs
2.4.3 Processing Requirements for FeRAMs
2.4.4 Roadmap for Commercialization

2.5 Ultrathin Wafers
2.5.1 Applications for Ultrathin Wafers
2.5.2 Substrate Thinning
2.5.3 Backside Metallization Requirements
2.5.4 Surface Stress Relief
2.5.5 Ultrathin Wafer Market

Chapter 3 Niche Markets for EQUIPMENT for SUB 300mm Wafers

3.1 Introduction
3.2 MEMs
3.2.1 The MEMS Market Infrastructure
3.2.2 Forecast Of The Key Applications And Markets
– MEMS Device Market Forecast
– MEMS System Market Forecast

3.2.3 Markets for Equipment and Materials Suppliers
3.3 HB-LEDs
3.3.1 Recent Progress in High Brightness LED Technology and Applications
3.3.2 Processing Equipment
3.3.3 Materials of Construction
3.3.4 OLED Manufacturing
3.3.5 Outlook for the Worldwide OLED Market
3.3.6 Outlook for the Worldwide HB-LED Market
3.4 Compound Semiconductors
3.4.1 GaAs Devices
3.4.2 Equipment Trends
3.4.3 Wafer Sizes
3.4.4 GaAs IC Market Forecast
3.4.5 Competing Against SiGe
3.5 Thin Film Read/Write Heads for HDD
3.5.1 Trends in HDDs
3.5.2 Recording Head Market Forecast
3.5.3 Head Processing
3.5.4 Head Fabrication – CMP, Deposition, Lithography
3.5.5 CMP Challenges
3.5.6 Lithography Challenges
3.6 Bulk Acoustic Wave (BAW)
3.6.1 Basic Elements of the BAW Device
3.6.2 AlN Layer Quality Requirements
3.6.3 Equipment Requirements for BAW and FBAR Filtering Devices
3.6.4 Bulk Acoustic Wave (BAW) Market

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Media Contact: Laura Wood , +353-1-481-1716, [email protected]